cystech electronics corp. spec. no. : c347sc issued date : 2011.05.30 revised date : page no. : 1/ 5 sk220sc-sk2150sc cystek product specification 2.0amp. surface mount schottky barrier diodes sk220sc-sk2150sc series features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high surge capability ? high temperature soldering: 250 c/10 seconds at terminals ? exceeds environmental standards of mil-s-19500/228 mechanical data ? case: molded plastic, smc/jedec do-214ab. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? mounting position : any. ? weight: 0.195 gram, 0.00585 ounce maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) type parameter symbol sk220 SK240 sk260 sk2100 sk2150 units repetitive peak reverse voltage v rrm 20 40 60 100 150 v maximum rms voltage v rms 14 28 42 70 105 v maximum dc blocking voltage v r 20 40 60 100 150 v maximum instantaneous forward voltage, i f =2a v f 0.50 0.7 0.85 0.9 v average forward rectified current i o 2 a peak forward surge current @8.3ms single half sine wave superimposed on rate d load (jedec method) i fsm 50 a maximum dc reverse current v r =v rrm ,t a =25 v r =v rrm ,t a =125 i r 0.5 10 ma ma maximum thermal resistance, junction to ambient r th,ja 55 maximum thermal resistance, junction to lead r th,jl 20 (note) /w diode junction capacitance @ f=1mhz and applied 4vdc reverse voltage c j 170(typ) pf storage temperature tstg -55 ~ +150 operating temperature t j -55 ~ +125 -55 ~ +150 note : measure on pcb with 0.2? 0.2?(5mm 5mm) copper pad area.
cystech electronics corp. spec. no. : c347sc issued date : 2011.05.30 revised date : page no. : 2/ 5 sk220sc-sk2150sc cystek product specification characteristic curves forward current derating curve 0 0.5 1 1.5 2 2.5 0 50 100 150 200 ambient temperature---t a () average forward current---io(a) maximum non-repetitive forward surge current 0 10 20 30 40 50 60 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) t j =25 , 8.3ms sin g le hal f sine wave jedec method forward current vs forward voltage 0.01 0.1 1 10 0.10.30.50.70.91.11.31.5 forward voltage---v f (v) instantaneous forward current---i f (a) tj=25, pulse width=300s, 1% duty cycle sk22-sk24 sk26 sk28-sk2b junction capacitance vs reverse voltage 0 100 200 300 400 500 600 700 0.01 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (ma) tj=75 tj=25
cystech electronics corp. spec. no. : c347sc issued date : 2011.05.30 revised date : page no. : 3/ 5 sk220sc-sk2150sc cystek product specification ordering information device package shipping marking sk220sc smc 3000 pcs / tape & reel sk22 SK240sc smc 3000 pcs / tape & reel sk24 sk260sc smc 3000 pcs / tape & reel sk26 sk2100sc smc 3000 pcs / tape & reel s210 sk2150sc smc 3000 pcs / tape & reel s215
cystech electronics corp. spec. no. : c347sc issued date : 2011.05.30 revised date : page no. : 4/ 5 sk220sc-sk2150sc cystek product specification recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c347sc issued date : 2011.05.30 revised date : page no. : 5/ 5 sk220sc-sk2150sc cystek product specification do-214ab/smc dimension do-214ab/smc plastic surface mounted package cystek package code : sc *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.114 0.126 2.90 3.20 e 0.006 0.012 0.15 0.31 b 0.220 0.245 5.59 6.22 f 0.004 0.008 0.10 0.20 c 0.260 0.280 6.60 7.11 g 0.030 0.060 0.76 1.52 d 0.078 0.103 1.98 2.62 h 0.305 0.320 7.75 8.13 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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